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Copper Diffusion Into Alumimum-Silicon Metallizations by Accelerated Thermal and Electrical Stressing

Author(s):
Ramseyer, G. O.
Walsh, L. H.
Beasock, J. V.
Helbig, H. F.
Lacoe, R. C.
Brown, S.
1 more
Publication title:
Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
428
Pub. date:
1996
Page(from):
219
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993310 [1558993312]
Language:
English
Call no.:
M23500/428
Type:
Conference Proceedings

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