MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging

MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging

Author(s):

Bristow,J.P. ( Honeywell Technology Ctr. )

Publication title:

Optoelectronic Packaging

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2691

Pub. Year:

1996

Page(from):

18

Page(to):

24

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819420657 [0819420654]

Language:

English

Call no.:

P63600/2691

Type:

Conference Proceedings

Details

TDL ID:	ZA00017476
Series ID:	PA00000029
Conf. info. (Name):	Photonics West : Optoelectronic Packaging
Conf. info. (Number):	1996
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1996.02.01-1996.02.02

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