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Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation

Author(s):
Publication title:
Intergranular and interphase boundaries in materials : iib98 : proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib98), held in Prague, Czech Republic, July, 1998
Title of ser.:
Materials science forum
Ser. no.:
294-296
Pub. date:
1999
Page(from):
341
Page(to):
344
Pub. info.:
Zurich-Uetikon, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878498239 [0878498230]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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