Precipitation of Copper Silicide at Grain Boundary in Silicon

Precipitation of Copper Silicide at Grain Boundary in Silicon

Author(s):

Publication title:

Intergranular and interphase boundaries in materials : iib92 : proceedings of the 6th International Congress, Thessaloniki, Greece, June 21-26, 1992

Title of ser.:

Materials science forum

Ser. no.:

126-128

Pub. Year:

1993

Page(from):

659

Page(to):

662

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878496600 [0878496602]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00017431
Series ID:	PA00000012
Conf. info. (Name):	International Congress on Intergranular and Interphase Boundaries in Materials
Conf. info. (Number):	1992
Conf. info. (Venue):	Thessaloniki, Greece
Conf. info. (Date):	1992.06.21-1992.06.26

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