Electroless Cu and barrier layers for subhalf-micron multilevel interconnects

Electroless Cu and barrier layers for subhalf-micron multilevel interconnects

Author(s):

Lopatin,S. ( Cornell Univ. )
Shacham-Diamand,Y. ( Cornell Univ. )
Dubin,V. ( Advanced Micro Devices,Inc. )
Vasudev,P.K. ( SEMATECH )

Publication title:

Multilevel Interconnect Technology

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3214

Pub. Year:

1997

Page(from):

21

Page(to):

32

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819425461 [081942546X]

Language:

English

Call no.:

P63600/3214

Type:

Conference Proceedings

Details

TDL ID:	ZA00017398
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Multifevel Interconnect Technology
Conf. info. (Number):	1997
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1997.10.01-1997.10.02

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