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Extension of high-density interconnect multichip module technology for MEMS packaging

Author(s):
Publication title:
Micromachined Devices and Components III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3224
Pub. date:
1997
Page(from):
169
Page(to):
177
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819426567 [0819426563]
Language:
English
Call no.:
P63600/3224
Type:
Conference Proceedings

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