Stress analysis for the optimization of a new plastic package for optical sensors

Stress analysis for the optimization of a new plastic package for optical sensors

Author(s):

Cotofana,C.V.B. ( Delft Univ.of Technology (Netherlands) )
Bossche,A. ( Delft Univ.of Technology (Netherlands) )
Mollinger,J.R. ( Delft Univ.of Technology (Netherlands) )
Kaldenberg,P. ( Nedcard BV (Netherlands) )

Publication title:

Micromachined Devices and Components IV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3514

Pub. Year:

1998

Page(from):

72

Page(to):

81

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819429735 [0819429732]

Language:

English

Call no.:

P63600/3514

Type:

Conference Proceedings

Details

TDL ID:	ZA00017376
Series ID:	PA00000029
Conf. info. (Name):	Micromachining and Microfabrication : Micromachined Devices and Components
Conf. info. (Number):	1998 : 4th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1998.09.21-1998.09.22

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