Wafer bonding with an adhesive coating
- Author(s):
- Klink,G. ( Fraunhofer-Institute for Solid State Technology (Germany) )
- Hillerich,B. ( Fraunhofer-Institute for Solid State Technology (Germany) )
- Publication title:
- Micromachined Devices and Components IV
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3514
- Pub. Year:
- 1998
- Page(from):
- 50
- Page(to):
- 61
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819429735 [0819429732]
- Language:
- English
- Call no.:
- P63600/3514
- Type:
- Conference Proceedings
Similar Items:
SPIE-The International Society for Optical Engineering |
Materials Research Society |
2
Conference Proceedings
Simultaneous fabrication of dielectric and electric joints by wafer bonding
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |
Electrochemical Society |
Materials Research Society |
10
Conference Proceedings
Adhesive Bonding of III-V Dies to Processed SOI Using BCB for Photonic Applications
Electrochemical Society |
5
Conference Proceedings
Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
6
Conference Proceedings
Room Temperature, Adhesive Bonding for Wafer Scale Packaging of Fluidic Microsystems
Electrochemical Society |
Electrochemical Society |