Comparison of Aluminum, Wood, and Epoxy as Thermoforming Mold Material

Comparison of Aluminum, Wood, and Epoxy as Thermoforming Mold Material

Author(s):: Oliver, D. ( Pittsburgh State University )
Publication title:: ANTEC 2000 Conference proceedings, May 7-11, 2000, Orlando, Florida
Title of ser.:: Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:: 46
Pub. Year:: 2000
Pt.:: 3
Page(from):: 3457
Page(to):: 3460
Pages:: 4
Pub. info.:: Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
ISBN:: 9781566768559 [1566768551]
Language:: English
Call no.:: S42700/46
Type:: Conference Proceedings

Details

TDL ID:	ZA00021094
Series ID:	PA00000030
Conf. info. (Name):	ANTEC 2000 : Annual Technical Conference
Conf. info. (Number):	58th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2000.05.07-2000.05.11
Note for article:	STUDENTS DIVISION

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