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Stress effect on the via crack of IMD structure in scrubber processing

Author(s):
Huang,D.F. ( Taiwan Semiconductor Manufacturing Co. )
Yeh,R.S.
Lin,T.-Y.
Hung,C.-C.
Lin,T.C.
Chang,C.H.
Chen,C.H.
2 more
Publication title:
Device and process technologies for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3892
Pub. Year:
1999
Page(from):
377
Page(to):
384
Pub. info.:
Bellingham, Wash., USA: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434937 [0819434930]
Language:
English
Call no.:
P63600/3892
Type:
Conference Proceedings

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