Optimizing the clean effect of wafer backside in lithography developer process
- Author(s):
- Lin,H.-P. ( Taiwan Semiconductor Manufacturing Co. )
- Chang,C.-H.
- Lee,C.-H.
- Pang,S.L.
- Lu,K.L.
- Publication title:
- Process, equipment, and materials control in integrated circuit manufacturing V : 22-23 September, 1999, Santa Clara, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3882
- Pub. Year:
- 1999
- Page(from):
- 193
- Page(to):
- 199
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819434791 [0819434795]
- Language:
- English
- Call no.:
- P63600/3882
- Type:
- Conference Proceedings
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