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Laser-induced particle removal from silicon wafers

Author(s):
Leiderer,P. ( Univ.of Konstantz )
Boneberg,J.
Dobler,V.
Mosbacher,M.
Munzer,H.-J.
Chaoui,N.
Siegel,J.
Solis,J.
Afnso,C.N.
Fourrier,T.
Schrems,G.
Bauerle,D.
7 more
Publication title:
High-power laser ablation III, 24-28 April 2000, Santa Fe, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4065
Pub. Year:
2000
Page(from):
249
Page(to):
259
Pub. info.:
Bellingham, Wash., USA: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819437006 [081943700X]
Language:
English
Call no.:
P63600/4065
Type:
Conference Proceedings

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