Modelling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects
- Author(s):
- Publication title:
- Semiconductor process and device performance modeling : symposium held December 2-3, 1997, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 490
- Pub. Year:
- 1998
- Page(from):
- 219
- Pub. info.:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993952 [1558993959]
- Language:
- English
- Call no.:
- M23500/490
- Type:
- Conference Proceedings
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