Blank Cover Image

On Advanced Interconnect Using Low Dielectric Constant Materials as Interlevel Dielectrics

Author(s):
Zhao, Bin
Wang, Shi-Qing
Anderson, Steven
Lam, Robbie
Fiebig, Marcy
Vasudev, P. K.
Seidel, Thomas E.
2 more
Publication title:
Advanced metallization for future ULSI : symposium held April 8-11, 1996, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
427
Pub. Year:
1996
Page(from):
415
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993303 [1558993304]
Language:
English
Call no.:
M23500/427
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Reaction Between Low-Dielectric-Constant Fluorinated Polyimide and Aluminum

Tong, H. Y., Szalkowski, F. J., Shi, F. G., Zhao, B., Brongo, M., Wang, S-Q., Vasudev, P. K.

MRS - Materials Research Society
7 Conference Proceedings 0.1ｦﾌm Interconnect Technology Challenges and the SIA Road Map

Seidel, Tom, Zhao, Bin

MRS - Materials Research Society
2 Conference Proceedings Compatibility of Low Dielectric Constant Poly (arylether) with the Electroless Copper Deposition Solution

Hsu, D., Iskander, M., Tong, H.Y., Shi, F., Lopatin, S., Shacham-Diamand, Y., Zhao, B., Brongo, M., Vasudev, P.K.

Electrochemical Society
8 Conference Proceedings MATERIALS REQUIREMENTS FOR FUTURE SEMICONDUCTOR TECHNOLOGY

Seidel, T.E., Vasudev, P.K., Stanley, T.

Electrochemical Society
3 Conference Proceedings Integration of Low-Dielectric Constant Materials in Advanced Aluminum and Copper Interconnects

Zhao, B., Brongo, M.

MRS - Materials Research Society
9 Conference Proceedings Thermal Conductivity Measurements of Interlevel Dielectrics

Varner, Elizabeth B., Marieb, Thomas, Mack, Anne Sauter, Lee, Jin, Meyer, William K., Goodson, Kenneth E.

MRS - Materials Research Society
4 Conference Proceedings Integration of Low-Dielectric Constant Materials in Advanced Aluminum and Copper Interconnects

Brongo, B. ZhaoM.

Materials Research Society
10 Conference Proceedings A New Low-Dielectric Constant Polymer Material (K < 2): Microstructure, Electrical Properties, and Mechanical Properties

Brongo, N., Liao, C. N., Liu, Q-Z., Tsal, Y-P., Tu, K. N., Xu, Y., Zhao, B.

Materials Research Society
5 Conference Proceedings Low Dielectric Constant Polymers for On-Chip Interlevel Dielectrics with Copper Metallization

Gutmann, Ronald J., Chow, T. Paul, Duquette, David J., Lu, Toh-Ming, McDonald, John F., Murarka, Shyam P.

MRS - Materials Research Society
11 Conference Proceedings Investigations of the Low Dielectric Constant Fluorinated Polyimide for Use as the Interlayer Dielectric in ULSI

Lee, Y. K., Murarka, S. P., Jeng, S. -P., Auman, B.

MRS - Materials Research Society
6 Conference Proceedings Interaction between the Electroless Copper Deposition Solution and the Low-k Fluorinated Dielectrics

Hsu, D.T., Tong, H.Y., Shi, F.G., Lopatin, S., Shacham-Diamand, Y., Zhao, B., Brongo, M., Vasudev, P.K.

Electrochemical Society
12 Conference Proceedings On The Mechanical Integrity Of Ultra Low Dielectric Constant Materials For Use In ULSI BEOL Structures

Shaffer II, E.O., Howard, K.E., Mills, M.E., Townsend III, P.H.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12