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EFFECT OF MECHANICAL STRESS ON ELECTROMIGRATION FAILURE MODE DURING ACCELERATED ELECTROMIGRATION TESTS

Author(s):
Pramanick, S.
Brown, D. D.
Pham, V,
Besser, P.
Sanchez, J.
Bui, N.
Hijab, R.
Yue, J. T.
3 more
Publication title:
Thin films, stresses and mechanical properties V : symposium held November 28-December 2, 1994, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
356
Pub. Year:
1995
Page(from):
507
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992573 [155899257X]
Language:
English
Call no.:
M23500/356
Type:
Conference Proceedings

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