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Combination of ray-trace and diffraction modeling to describe coupling laser diodes to fibers and waveguides

Author(s):
Publication title:
Laser Diode Chip and Packaging Technology
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2610
Pub. date:
1996
Page(from):
194
Page(to):
202
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819419743 [0819419745]
Language:
English
Call no.:
P63600/2610
Type:
Conference Proceedings

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