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*Mechanistic studies of wafer bonding and thin silicon film exfoliation

Author(s):
Publication title:
Substrate engineering - paving the way to epitaxy : sympoisum held November 29-December 3, 1999, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
587
Pub. Year:
2000
Page(from):
O4.4.1
Pub. info.:
Warrendale, Pa.: MRS-Materials Research Society
ISSN:
02729172
ISBN:
9781558994959 [1558994955]
Language:
English
Call no.:
M23500/587
Type:
Conference Proceedings

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