Blank Cover Image

Void Formation in Neutron- and Ion-Irradiated Copper and Nickel

Author(s):
Publication title:
Microstructural processes in irradiated materials : symposium held November 30-December 2, 1998, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
540
Pub. Year:
1999
Page(from):
527
Pub. info.:
Warrendale, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994461 [1558994467]
Language:
English
Call no.:
M23500/540
Type:
Conference Proceedings

Similar Items:

Mukouda, Ichiro, Shimomura, Yoshiharu

Materials Research Society

Vainshtein,D.I., Altena,C., Hartog,H.W.den

Trans Tech Publications

Mukouda, I., Shimomura, Y., Iiyama, T., Katano, Y., Yamaki, D., Nakazawa, T., Noda, K.

MRS - Materials Research Society

Hahner. P, Frank. W

Kluwer Academic Publishers

Shimomura, Y., Mukouda, I.

Materials Research Society

Shimomura,Y., Fukushima,H., Kiritani,N., Guinan,M.W.

Trans Tech Publications

Shimomura, Y., Sugio, K., Ohkubo, H., Mukouda, I., Kutsukake, C., Takeuchi, H.

Materials Research Society

10 Conference Proceedings Cementation of Copper Ions by Nickel Metal

Ho, E.M., Ritchie, I.M.

Electrochemical Society

Eldrup, M., Singh, B.N.

Trans Tech Publications

Nguy,T., Corbel,C., Barbu,A., Moser,P.

Trans Tech Publications

Hoelzer, D. T., Ebrahimi, F.

MRS - Materials Research Society

Haehner,P., Frank,W.

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12