Laser processes for multichip module's high-density multilevel thin film packaging

Laser processes for multichip module's high-density multilevel thin film packaging

Author(s):

Patel,R.S. ( IBM Microelectronics )
Wassick,T.A.

Publication title:

Laser Applications in Microelectronic and Optoelectronic Manufacturing II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2991

Pub. Year:

1997

Page(from):

217

Page(to):

223

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819424020 [0819424021]

Language:

English

Call no.:

P63600/2991

Type:

Conference Proceedings

Details

TDL ID:	ZA00016567
Series ID:	PA00000029
Conf. info. (Name):	Photonics West : Laser Applications in Microelectronic and Optoelectronic Manufacturing
Conf. info. (Number):	1997 : 2nd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1997.02.10-1997.02.12

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