Blank Cover Image

Electrical performance analysis of IC package for the high-end memory device(Invited Paper)

Author(s):
  • Lee,D.H. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Han,C.M. ( Samsung Electronics Co.,Ltd.(Korea) )
Publication title:
Microelectronic Packaging and Laser Processing
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3184
Pub. Year:
1997
Page(from):
86
Page(to):
94
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819426116 [0819426113]
Language:
English
Call no.:
P63600/3184
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Study for high voltage gate RIE process in LOI (LCD driver IC) device fabrication

M. G. Lee, C. K. Jung, S. W. Ryu, K. H. Lee, J. W. Han

Society of Photo-optical Instrumentation Engineers
7 Conference Proceedings Long-wavelength VCSEL devices on GaAs substrates (Invited Paper)

Chi, J. Y., Yang, H.-P. D., Lu, C.-M., Hsiao, R.-S., Chiou, C.-H., Lee, C.-H., Huang, C.-Y., Yu, H.-C., Wang, C.-M., …

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Diffraction efficiency of thin film holographic beam steering devices (Invited Paper)

Titus, C.M., Pouch, J., Nguyen, H.D., Miranda, F., Bos, P.J.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Wafer level optoelectronic device packaging using MEMS (Invited Paper)

Nallani, A., Chen, T., Lee, J.-B., Hayes, D., Wallace, D.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Inspection sensitivity improvement through optimization of lobe blocking on high-end memory devices

C. Lee, S. Won, D. Seo, H. Kim, J. Kim, J. Yeo, I. Dolev, C. Kwak

SPIE - The International Society of Optical Engineering
9 Conference Proceedings A Unified Cutting Force Model for Flat End Mills Based on Cutter Geometry and Material Properties

X.D. Zhang, C. Han, D.H. Zhang, M. Luo

Trans Tech Publications
4 Conference Proceedings Pulsed laser ablation of IC packages for device failure analyses

Hong, M.H., Mai, Z.H., Chen, G.X., Thiam, T., Song, W.D., Lu, Y.F., Soh, C.E., Chong, T.C.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings High-speed high-density holographic memory using electro-optic beams steering devices (Invited Paper)

Chao, T.-H., Zhou, H., Reyes, G.F., Dragoi, D., Hanan, J.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)

Chang, G. -K., Guidotti, D., Huang, Z. R., Wan, L., Yu, J., Hegde, S., Kuo, H. -F., Chang, Y, -J., Liu, F., Wang, F., …

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Probing high-density plasmas with soft x-ray lasers (Invited Paper)

Celliers,P.M., Barbee,T.W.,Jr., Cauble,R.C., Da Silva,L.B., Decker,C.D., Kalantar,D.H., Key,M.H., London,R.A., …

SPIE-The International Society for Optical Engineering
6 Conference Proceedings High performance directly modulated lasers: device physics (Invited Paper)

White, J.K., Knight, G., Das, S., Finlay, R.J., Jones, T., Blaauw, C., Fekecs, A., Walters, H., Grevatt, T., Brooks, N., …

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Device Fabrication and Evaluation of Alternative High-K Dielectrics and Gate Electrodes Using a Non-Self Aligned Gate process

Kim, I., Han, S.K., Kiether, W., Lee, S.J., Lee, C.H., Luan, H.F., Luo, Z., Rying, E., Wicaksana, Z.Wang D., Zhu, W., …

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12