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Developments of optimum flip-chip bonding process

Author(s):
  • Jang,D.H. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Kang,S.K. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Lee,Y.M. ( Samsung Electronics Co.,Ltd.(Korea) )
  • Oh,S.Y. ( Samsung Electronics Co.,Ltd.(Korea) )
Publication title:
Microelectronic Packaging and Laser Processing
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3184
Pub. Year:
1997
Page(from):
5
Page(to):
12
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819426116 [0819426113]
Language:
English
Call no.:
P63600/3184
Type:
Conference Proceedings

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