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Evaluation of pad life in chemical mechanical polishing process using statistical metrology

Author(s):
Muthukrishnan,N.M. ( LSI Logic Corp. )
Prasad,S. ( LSI Logic Corp. )
Stine,B.E. ( Massachusetts Institute of Technology )
Loh,W. ( LSI Logic Corp. )
Nagahara,R. ( LSI Logic Corp. )
Chung,J.E. ( Massachusetts Institute of Technology )
Boning,D.S. ( Massachusetts Institute of Technology )
2 more
Publication title:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3216
Pub. date:
1997
Page(from):
70
Page(to):
79
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819426482 [0819426482]
Language:
English
Call no.:
P63600/3216
Type:
Conference Proceedings

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