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Optomechanical,electrical,and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Author(s):
Ayliffe,M.H. ( McGill Univ.(Canada) )
Kabal,D. ( McGill Univ.(Canada) )
Khurana,P. ( McGill Univ.(Canada) )
lacroix,F.K. ( McGill Univ.(Canada) )
Kirk,A.G. ( McGill Univ.(Canada) )
Tooley,F.A.P. ( McGill Univ.(Canada) )
Plant,D.V. ( McGill Univ.(Canada) )
2 more
Publication title:
Optics in Computing '98
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3490
Pub. Year:
1998
Page(from):
502
Page(to):
505
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819429490 [081942949X]
Language:
English
Call no.:
P63600/3490
Type:
Conference Proceedings

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