Blank Cover Image

Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns

著者名:
掲載資料名:
Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008
シリーズ名:
Materials science forum
シリーズ巻号:
569
発行年:
2008
開始ページ:
117
終了ページ:
120
総ページ数:
4
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

類似資料:

1 国際会議録 The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate

H.J. Lee, B.Y. Park, H.S. Lee, S.H. Jeong, H.D. Seo

Trans Tech Publications
7 国際会議録 Texture Evolution in Ni Substrate Prepared by Powder Metallurgy and Casting Methods

J.H. Lim, K.T. Kim, E.C. Park, J.H. Joo, H.S. Kim, H.J. Lee, S.B. Jung, W.S. Nah

Trans Tech Publications
2 国際会議録 Experimental Analysis in Lithium Niobate CMP for Room Temperature Bonding

H.C. Cho, S.H. Jeong, J.H. Park, H.J. Lee, J.H. Oh

Trans Tech Publications
8 国際会議録 Fabrication of Bi-2212/SrSO4 Composite Superconductors by Melting Powder Mixtures

K.T. Kim, S.H. Jang, J.H. Lim, E.C. Park, J.H. Joo, H.J. Lee, G.W. Hong, C.J. Kim, H.R. Kim, O.B. Hyun

Trans Tech Publications
3 国際会議録 Determination of the Planarization Distance for Copper CMP Process

Banet, M., Boning, D., Brown, T., Hymes, S., Joffe, M., Nguyen, J., Park, T., Smekalin, K., Ss, endW., Tugbawa, T., …

Materials Research Society
9 国際会議録 Fogging and pattern loading effect by writing strategy

Cho, J.S., Baek, S.H., Nam, K.H., Cho, H.J., Courboin, D., Jeong, S.H., Lee, I.S., Shin, C., Kim, H.S.

SPIE-The International Society for Optical Engineering
4 国際会議録 Coherent Chip-Scale Modeling for Copper CMP Pattern Dependence

Cai, Hong, Park, Tae, Boning, Duane, Kim, Hyungjun, Kang, Youngsoo, Kim, Sibum, Lee, Jeong-Gun

Materials Research Society
10 国際会議録 Characterization and Fabrication of Nano-Sized Patterns and Microfluidic Channels Derived from Polyvinylsilazane via Soft Lithographic Technique

H.J. Lee, J.H. Park, P. Jayakumar, T.H. Yoon, L.Y. Hong, S.H. Park, D.P. Kim

Trans Tech Publications
5 国際会議録 Electrochemical Mechanical Planarization (eCMP) of Copper Thin Films

S. Aksu, I. Emesh, C. Uzoh, B. Basol

Electrochemical Society
11 国際会議録 Effect of Impurity and Gas Nature on Microstructure of SiC Microtubes in Double Step Reaction Process

Myoung, S.W., Kang, J.H., Park, S.H., Lee, S.S., Joo, D.W.

Trans Tech Publications
6 国際会議録 Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries

Eom, D.-H., Hong, Y.-K., Lee, S.-H., Park, J.-Y., Myung, J.-J., Park, J.-G., Kim, K.-S., Song, H.-S., Park, H.-S., Choi, …

Electrochemical Society
12 国際会議録 Planarized Metallization by the Blanket PACVD Aluminum for ULSI

Kim, B.-Y., Kim, D.-C., Lee, B.-I., Joo, S.-K.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12