1.

国際会議録
国際会議録
1. Scale Effects in the High Temperature Gas Pressure Forming of Electrodeposited Fine-Grained Copper Thin Sheet
K. Lei ; K.F. Zhang ; M.J. Tong
出版情報: Superplasticity in advanced materials : ICSAM 2006 : proceedings of the 9th International Conference on Superplasticity in Advanced Materials, 23-26 June 2006, Chengdu, P.R. China.  pp.347-356,  2007.  Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 551-552
2.

国際会議録
国際会議録
2. Superplastic Forming and Diffusion Bonding for Four-Layer Sheets Structure of Nickel-Base Superalloy
W.B. Han ; D.Z. Wu ; G.F. Wang ; M.J. Tong
出版情報: Superplasticity in advanced materials : ICSAM 2006 : proceedings of the 9th International Conference on Superplasticity in Advanced Materials, 23-26 June 2006, Chengdu, P.R. China.  pp.163-168,  2007.  Zuerich, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 551-552