1.

国際会議録
国際会議録
1. Investigation of Wall Thinning Measurement in Steel Plates by Electromagnetic Acoustic Resonance
K. Mitani ; M. Mochizuki ; M. Toyoda
出版情報: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.113-116,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 580-582
2.

国際会議録
国際会議録
2. INVESTIGATION OF THE N-TYPE INVERSION LAYER INDUCED AT THE BOTTOM OF P-TYPE ACTIVE SILICON LAYERS IN BONDED SOI WAFERS
K. Mitani ; A. Kanai ; K. Ohki ; M. Katayama ; T. Abe
出版情報: Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications.  pp.443-452,  1993.  Pennington, NJ.  Electrochemical Society
シリーズ名: Electrochemical Society Proceedings Series
シリーズ巻号: 1993-29
3.

国際会議録
国際会議録
3. Characteristics of experimental single-chip color HDTV image acquisition system with 8M-pixel image sensor
H. Shimamoto ; T. Yamashita ; R. Funatsu ; K. Mitani ; Y. Nojiri
出版情報: Digital photography III : 29-30 January 2007, San Jose, California, USA.  2007.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
シリーズ名: Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号: 6502