1.

国際会議録
国際会議録
1. Effects of In/Ce to Sn-3.5Ag Lead-Free Solder on Microstructures and Properties
E.J. Chen ; X.C. Zhao ; Y. Liu ; D.M. Li ; J.W. Cheng
出版情報: Materials performance, modeling and simulation : selected peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China.  pp.198-204,  2013.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 749
2.

国際会議録
国際会議録
2. A Very Thin Layer of NiO, Ni(OH)2 Nanosheets Arrays with Organic Functional Modification of Polyaniline
X.C. He ; Z.M. Si ; D.M. Li ; B. Zhang ; M.J. Gao
出版情報: Advanced Functional Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China.  pp.661-667,  2015.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 815
3.

国際会議録
国際会議録
3. Reliability Design for Creep Rupture Strength of 2.25Cr-1Mo Steel
J.B. Pei ; Y.F. Zhao ; D.M. Li ; J. Zhao ; L. Wang
出版情報: Advanced material science and technology : selected, peer reviewed papers from the 7th International Forum on Advanced Material Science and Technology, June 26-28, 2011, Dalian, China (IFAMST-7).  pp.507-510,  2011.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 675-677
4.

国際会議録
国際会議録
4. Thermodynamic Analysis of Ni-Al-WC System during Self-Propagating High Temperature Synthesis
J.J. Yuan ; X.Y. Liu ; D.M. Li ; S.M. Lou
出版情報: IUMRS International Conference in Asia.  pp.1569-1574,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 898