1.

国際会議録
国際会議録
1. Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns
S.H. Jeong ; S.B. Joo ; H.J. Lee ; B.Y. Park ; H.J. Kim
出版情報: Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008.  pp.117-120,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 569
2.

国際会議録
国際会議録
2. The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate
H.J. Lee ; B.Y. Park ; H.S. Lee ; S.H. Jeong ; H.D. Seo
出版情報: Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008.  pp.133-136,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
シリーズ名: Materials science forum
シリーズ巻号: 569
3.

国際会議録
国際会議録
3. Fractal Carbon-MEMS Architectures for 3D Miniature Power and Sensor Applications
M.J. Madou ; R. Zaouk ; C. Wang ; B.Y. Park
出版情報: Three-Dimensional Micro- and Nanoscale Battery Architectures.  pp.1-11,  2006.  Pennington, NJ.  Electrochemical Society
シリーズ名: ECS transactions
シリーズ巻号: 1(20)