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Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules

著者名:
Satishchandra C. Wani  
掲載資料名:
2015 SAE world congress : technical paper
シリーズ名:
Society of Automotive Engineers technical paper series
シリーズ巻号:
2015
発行年:
2015
通号:
2015-01-0195
ペーパー番号:
2015-01-0195
総ページ数:
5
出版情報:
Warrendale, Penn.: Society of Automotive Engineers
ISSN:
01487191
言語:
英語
請求記号:
S10400
資料種別:
テクニカルペーパー

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