Reliability Testing and Damage Analysis of Lead-Free Solder Joints: New Assessment Criteria for Laboratory Methods.

Reliability Testing and Damage Analysis of Lead-Free Solder Joints: New Assessment Criteria for Laboratory Methods.

著者名:

掲載資料名:

2009 SAE world congress : technical paper

シリーズ名:

Society of Automotive Engineers technical paper series

シリーズ巻号:

2009

発行年:

2009

通号:

2009-01-1368

ペーパー番号:

2009-01-1368

総ページ数:

9

出版情報:

Warrendale, Penn.: Society of Automotive Engineers

ISSN:

01487191

言語:

英語

請求記号:

S10400

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00052095
シリーズID:	PA00000058
会議名:	SAE World Congress & Exhibition, 2009
回次:	2009
会議開催地:	Detroit, MI, USA
会議開催年:	2009.04.20-2009.04.23
論文注記:	SAE 2009 World Congress, April 20-23, 2009, Detroit, Michigan, USA

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