Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEG

Effect of Curing Agent N-100 on the Thermal Decomposition Mechanism of Binder PEG

著者名:

Y. Sun ( Department of Chemical Physics University of Science and Technology of Chian, Hefei, Anhui, China (prc) )

掲載資料名:

AIAA meeting papers on disc

シリーズ名:

AIAA Paper : AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit

シリーズ巻号:

2007

発行年:

2007

通号:

2007-5700

ペーパー番号:

AIAA Paper 2007-5700

出版情報:

Reston, Va.: American Institute of Aeronautics and Astronautics

ISSN:

10877215

言語:

英語

請求記号:

A07400/200716 [CD-ROM 2007 Disc 16]

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00049508
シリーズID:	PA00000151
会議名:	AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit
回次:	43rd
会議開催地:	Cincinnati, OH
会議開催年:	2007.07.08-2007.07.11
論文注記:	43rd AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit, Cincinnati, OH, July 8-11, 2007

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