The Application of CM-ECM Technology to Metal Surface Finishing. | 東京工業大学附属図書館文献データベース

Blank Cover Image

The Application of CM-ECM Technology to Metal Surface Finishing.

著者名:

掲載資料名:

SME technical paper

発行年:

2000

通号:

MR00-209

ペーパー番号:

MR00-209

総ページ数:

6

出版情報:

Society of Manufacturing Engineers

言語:

英語

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:

ZA00001682

類似資料:

1 テクニカルペーパー Application of ECM Techonology in automotive related parts surface finishing Sun, J.J., Taylor, E.J., Inman, M.E., Renz, R.P., Gebhart, L.E. Society of Manufacturing Engineers	7 国際会議録 Development and Characterization of Plating Cell Geometry for PCB and Packaging Applications. H. Garich, L. Gebhart, E.J. Taylor, M. Inman, H. McCrabb Electrochemical Society
2 国際会議録 A Sequential Copper Plating Process for Multiple Feature Sizes for HDI Applications Sun, J.J., Taylor, E.J., Inman, M.E. Electrochemical Society	8 国際会議録 Determination of Diffusion Boundary Layers and Copper Thickness Uniformity in Plating Tools Designed for 3-D Interconnect and Packaging Applications H. McCrabb, H. Garich, L. Gebhart, M. Inman, E.J. Taylor Electrochemical Society
3 国際会議録 Appication of an Electrochemical Copper Metallization-Planarization Process to sub-0.25 um Features Sun, J.J., Taylor, E.J., Inman, M.E., Leady, K.D., Cortez, R. Electrochemical Society	9 テクニカルペーパー The Many Faces of Turbine Surface Roughness. Bons, J.P., Taylor, R.P., McClain, S.T., Rivir, R.B. American Society of Mechanical Engineers
4 国際会議録 2 In-Process Recycling of Plating Waste Water with a Novel Electrochange Recovery System Zhou, C.D., Taylor, E.J., Stortz, E.C., Renz, R.P., Sun, J.J. Electrochemical Society	10 テクニカルペーパー NDE Technology for Ceramic Composites. Ellingson, W.A., Deemer, C.M., Sun, J., Koehl, E.R. American Society of Mechanical Engineers
5 テクニカルペーパー Surface finishing techniques for rapid prototyping Spencer, J.D., Cobb, R.C., Dickens, P.M. Society of Manufacturing Engineers	11 テクニカルペーパー A Low Cost Angular Rate Sensor in Si-Surface Micromachining Technology for Automotive Application Thomae,A., Schellin,R., Lang,M., Bauer,W., Mohaupt,J., Bischopink,G., Tanten,L., Baumann,H., Emmerich,H., Pinter,S., … Society of Automotive Engineers
6 国際会議録 Modulated Reverse Electric Field Copper Metallization for High Density Interconnect and Very Large Scale Integration Applications Sun, J.J., Taylor, E.J., Leedy, K.D., Via, G.D., O'Keefe, M.J., Inman, M.E., Zhou, C.D. Electrochemical Society	12 テクニカルペーパー A Low Cost Angular Rate Sensor in Si-Surface Micromachining Technology for Automotive Application Thomae, A., Schellin, R., Lang, M., Bauer, W., Mohaupt, J., Bischopink, G., Tanten, L., Baumann, H., Emmerich, H., … Society of Automotive Engineers

1

2

3

4

5

6

7

8

9

10

11

12