Lead- Free Solder- Joint Reliability of a Photonic Device Under Transient and Steady State Loadings.
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American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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テクニカルペーパー
Temperature-dependent elasto-plastic-creep analysis of a low cost chip size package (NuCSP)'s solder joints
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
Society of Automotive Engineers |
The American Society of Mechanical Engineers |
Society of Automotive Engineers |
American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |