Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints.

Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints.

著者名:

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : IMECE

シリーズ巻号:

2003

発行年:

2003

通号:

IMECE2003-42117

ペーパー番号:

IMECE2003-42117

総ページ数:

4

出版情報:

New York, NY: American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00001646
シリーズID:	PA00000135
会議名:	ASME International Mechanical Engineering Congress
回次:	2003
会議開催地:	Washington, D.C.
会議開催年:	2003.11.15-2003.11.21
論文注記:	International Mechanical Engineering Congress, ASME, Washington, DC, 15-21 Nov. 2003

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