Continuous Improvement Efforts in Wire Bonding

Continuous Improvement Efforts in Wire Bonding

著者名:

Lynch,Donald P. ( Diamond Electric Manufacturing Corporation )
Fleischmann,Jay E. ( Colorado State University )
Duff,William S.

掲載資料名:

Six Sigma and Accelerated Testing ; Detroit, Michigan, March 4-7, 2002

シリーズ名:

SAE special publication

シリーズ巻号:

SP-1657

発行年:

2002

通号:

2002-01-0894

ペーパー番号:

2002-01-0894

開始ページ:

1

終了ページ:

8

総ページ数:

8

出版情報:

Society of Automotive Engineering, Inc.

ISBN:

9780768009255 [0768009251]

言語:

英語

請求記号:

S10350/SP1657

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00001362
シリーズID:	PA00000003
会議名:	Sae World Congress
回次:	2002
会議開催地:	Detroit, MI, USA
会議開催年:	2002.03.04-2002.03.07

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