Effects of ceramic ball-grid-array packages manufacturing variations on solder joint reliability

Effects of ceramic ball-grid-array packages manufacturing variations on solder joint reliability

著者名:

Ju, Teh-Hua ( University of Colorado )
Lin, Wei
Lee, Y. C.
Liu, Jay J.

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : WA/EEP

シリーズ巻号:

1993

発行年:

1993

通号:

93-WA/EEP-2

ペーパー番号:

93-WA/EEP-2

出版情報:

New York, NY: The American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00002588
シリーズID:	PA00000200
会議名:	ASME Winter Annual Meeting
回次:	1993
会議開催地:	New Orleans, Louisiana
会議開催年:	1993.11.28-1993.12.03
論文注記:	Presented at the ASME Winter Annual Meeting New Orleans, Louisiana-November 28-December 3, 1993

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