A finite element and experimental study to creep fatigue behaviors of microelectronics solder joints

A finite element and experimental study to creep fatigue behaviors of microelectronics solder joints

著者名:

Yu, Qiang ( Yokohama National University )
Shiratori, Masaki

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : WA/EEP

シリーズ巻号:

1995

発行年:

1995

通号:

95-WA/EEP-9

ペーパー番号:

95-WA/EEP-9

出版情報:

New York: The American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00002553
シリーズID:	PA00000200
論文注記:	Presented at the 1995 ASME International Mechanical Engineering Congress & Exposition San Francisco, California - November 12-17, 1995

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