Stress analyses of flip TAB interconnects in multi chip module assembly

Stress analyses of flip TAB interconnects in multi chip module assembly

著者名:

Nagaraj, Ben ( Motorola, Inc. )
Mahalingam, Mali

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : WA/EEP

シリーズ巻号:

1990

発行年:

1990

通号:

90-WA/EEP-22

ペーパー番号:

90-WA/EEP-22

出版情報:

New York, NY: The American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00002460
シリーズID:	PA00000200
会議名:	Winter Annual Meeting
回次:	1990
会議開催地:	Dallas, Texas
会議開催年:	1990.11.25-1990.11.30
論文注記:	Presented at the Winter Annual Meeting Dallas, Texas-November 25-30, 1990

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