Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array package

Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array package

著者名:

Lau, J. ( Express Packaging Systems, Inc. )
Chen, T.

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : WA/EEP

シリーズ巻号:

1998

発行年:

1998

通号:

98-WA/EEP-5

ペーパー番号:

98-WA/EEP-5

出版情報:

New York: The American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00002465
シリーズID:	PA00000200
会議名:	ASME International Mechanical Engineering Congress & Exposition
回次:	1998
会議開催地:	Anaheim, California
会議開催年:	1998.11.15-1998.11.20
論文注記:	Presented at the ASME International Mechanical Engineering Congress & Exposition Anaheim, California - November 15-20, 1998

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