Confirmation of creep and fatigue damage in Pb/Sn solder joints
- 著者名:
- Attarwala, A. I. ( The University of Texas at Austin )
- Tien, J. K.
- Masada, G.
- Dody, G.
- 掲載資料名:
- A.S.M.E. paper
- シリーズ名:
- ASME Technical Paper : WA/EEP
- シリーズ巻号:
- 1991
- 発行年:
- 1991
- 通号:
- 91-WA-EEP-32
- ペーパー番号:
- 91-WA-EEP-32
- 出版情報:
- New York, NY: The American Society of Mechanical Engineers
- 言語:
- 英語
- 請求記号:
- A11800
- 資料種別:
- テクニカルペーパー
類似資料:
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The American Society of Mechanical Engineers |
Materials Research Society |
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American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
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The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
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The American Society of Mechanical Engineers |
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テクニカルペーパー
A finite element and experimental study to creep fatigue behaviors of microelectronics solder joints
The American Society of Mechanical Engineers |
