Bending and twisting of 60Sn40Pb solder interconnects with creep
- 著者名:
- Lau, John H. ( Hewlett-Packard Company )
- 掲載資料名:
- A.S.M.E. paper
- シリーズ名:
- ASME Technical Paper : WA/EEP
- シリーズ巻号:
- 1993
- 発行年:
- 1993
- 通号:
- 93-WA/EEP-22
- ペーパー番号:
- 93-WA/EEP-22
- 出版情報:
- New York, NY: The American Society of Mechanical Engineers
- 言語:
- 英語
- 請求記号:
- A11800
- 資料種別:
- テクニカルペーパー
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