Bus bar solder joint durability evaluation
- 著者名:
- Wong, T. Eric ( Hughes Aircraft Company )
- Cohen, Harold M.
- 掲載資料名:
- A.S.M.E. paper
- シリーズ名:
- ASME Technical Paper : WA/EEP
- シリーズ巻号:
- 1995
- 発行年:
- 1995
- 通号:
- 95-WA/EEP-15
- ペーパー番号:
- 95-WA/EEP-15
- 出版情報:
- New York: The American Society of Mechanical Engineers
- 言語:
- 英語
- 請求記号:
- A11800
- 資料種別:
- テクニカルペーパー
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3
テクニカルペーパー
Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint
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