High- and low-cycle fatigue characteristics of leadless chip carrier solder joints
- 著者名:
- Fields, S. ( McDonnell Aircraft Company )
- Liguore, S.
- Followell, D.
- Perez, R.
- 掲載資料名:
- A.S.M.E. paper
- シリーズ名:
- ASME Technical Paper : WA/EEP
- シリーズ巻号:
- 1992
- 発行年:
- 1992
- 通号:
- 92-WA/EEP-26
- ペーパー番号:
- 92-WA/EEP-26
- 出版情報:
- New York, NY: The American Society of Mechanical Engineers
- 言語:
- 英語
- 請求記号:
- A11800
- 資料種別:
- テクニカルペーパー
類似資料:
The American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
3
テクニカルペーパー
Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint
The American Society of Mechanical Engineers |
9
テクニカルペーパー
Plastic deformation kinetics of eutectic Pb-Sn solder joints in monotonic loading and low-cycle fatigue
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
Society of Photo-optical Instrumentation Engineers |
The American Society of Mechanical Engineers |
National Aeronautics and Space Adminstration |
The American Society of Mechanical Engineers |
American Society of Mechanical Engineers |