Vibration fatigue of leadless chip carrier solder joints

Vibration fatigue of leadless chip carrier solder joints

著者名:

Liguore, S. ( McDonnell Aircraft Company )
Fields, S.
Followell, D.
Perez, R.

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : WA/EEP

シリーズ巻号:

1992

発行年:

1992

通号:

92-WA/EEP-25

ペーパー番号:

92-WA/EEP-25

出版情報:

New York, NY: The American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00002742
シリーズID:	PA00000200
会議名:	Winter Annual Meeting
回次:	1992
会議開催地:	Anaheim, CA
会議開催年:	1992.11.08-1992.11.13
論文注記:	Presented at the Winter Annual Meeting November 8-13, 1992 - Anaheim, CA

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1 テクニカルペーパー High- and low-cycle fatigue characteristics of leadless chip carrier solder joints Fields, S., Liguore, S., Followell, D., Perez, R. The American Society of Mechanical Engineers	7 テクニカルペーパー A Study of Loosening and Fatigue of Bolted Joints under Transverse Vibration. Hashimura, S., Socie, D.F. Society of Automotive Engineers
2 テクニカルペーパー Thermal fatigue damage in the solder joints of leadless chip resistors Govila, R. K., Jih, E., Pao, Y.-H., Larner, C. The American Society of Mechanical Engineers	8 テクニカルペーパー Design of surface mount leadless solder joints Jih, E., Pao, Y.-H., Chen, K. The American Society of Mechanical Engineers
3 テクニカルペーパー Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint Wong, T.E., Suastegui, I., Cohen, H.M., Matsunaga, A.H. The American Society of Mechanical Engineers	9 テクニカルペーパー Creep Behavior of flip-chip solder joints Hatsuda, T., Doi, H., Sakata, S., Hayashida, T. The American Society of Mechanical Engineers
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