Blank Cover Image

Fatigue properties of microelectronics solder joints

著者名:
掲載資料名:
A.S.M.E. paper
シリーズ名:
ASME Technical Paper : WA/EEP
シリーズ巻号:
1990
発行年:
1990
通号:
90-WA/EEP-28
ペーパー番号:
90-WA/EEP-28
出版情報:
New York, NY: The American Society of Mechanical Engineers
言語:
英語
請求記号:
A11800
資料種別:
テクニカルペーパー

類似資料:

Wong, T. E., Cohen, H. M., Chu, D. W.

The American Society of Mechanical Engineers

Govila, R. K., Jih, E., Pao, Y.-H., Larner, C.

The American Society of Mechanical Engineers

Wong, T. E., Lau, C. Y., Fenger, H. S.

American Society of Mechanical Engineers

Fields, S., Liguore, S., Followell, D., Perez, R.

The American Society of Mechanical Engineers

Wong, T.E., Kachatorian, L.A., Tierney, B.D.

The American Society of Mechanical Engineers

Yu, Qiang, Shiratori, Masaki

The American Society of Mechanical Engineers

4 テクニカルペーパー J-lead solder joint thermal fatigue life model

Wong, T.E., Kachatorian, L.A., Cohen, H.M.

The American Society of Mechanical Engineers

Sundararajan, R., Neel, J., Tiwari, N., Dasgupta, A., Barker, D.

The American Society of Mechanical Engineers

Liguore, S., Fields, S., Followell, D., Perez, R.

The American Society of Mechanical Engineers

11 テクニカルペーパー Bus bar solder joint durability evaluation

Wong, T. Eric, Cohen, Harold M.

The American Society of Mechanical Engineers

Wong, T.E., Suastegui, I., Cohen, H.M., Matsunaga, A.H.

The American Society of Mechanical Engineers

Islam, N., Suhling, J. C., Lall, P., Shete, T., Gale, H. S.

American Society of Mechanical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12