Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint
- 著者名:
- Wong, T.E. ( Raytheon Systems Company )
- Suastegui, I.
- Cohen, H.M.
- Matsunaga, A.H.
- 掲載資料名:
- A.S.M.E. paper
- シリーズ名:
- ASME Technical Paper : WA/EEP
- シリーズ巻号:
- 1998
- 発行年:
- 1998
- 通号:
- 98-WA/EEP-18
- ペーパー番号:
- 98-WA/EEP-18
- 出版情報:
- New York: The American Society of Mechanical Engineers
- 言語:
- 英語
- 請求記号:
- A11800
- 資料種別:
- テクニカルペーパー
類似資料:
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
|
The American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
