PBGA solder joint thermal fatigue life evaluation

PBGA solder joint thermal fatigue life evaluation

著者名:

Wong, T. E. ( Raytheon Systems Company )
Cohen, H. M.
Chu, D. W.

掲載資料名:

A.S.M.E. paper

シリーズ名:

ASME Technical Paper : IMECE/EEP

シリーズ巻号:

1999

発行年:

1999

通号:

99-IMECE/EEP-9

ペーパー番号:

99-IMECE/EEP-9

出版情報:

New York: The American Society of Mechanical Engineers

言語:

英語

請求記号:

A11800

資料種別:

テクニカルペーパー

詳細

TDL書誌ID:	ZA00002259
シリーズID:	PA00000236
会議名:	ASME International Mechanical Engineering Congress & Exposition
回次:	1999
会議開催地:	Nashville, Tennessee
会議開催年:	1999.11.14-1999.11.19
論文注記:	Presented at the ASME International Mechanical Engineering Congress & Exposition Nashville - Tennessee, November 14-19,

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