Microstructure and Crack Propagation of Electrically Conductive SiC Based Composites

Microstructure and Crack Propagation of Electrically Conductive SiC Based Composites

著者名:

掲載資料名:

Metallography XVI

シリーズ名:

Materials science forum

シリーズ巻号:

891

発行年:

2017

開始ページ:

547

終了ページ:

554

総ページ数:

8

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035710182 [303571018X]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00066563
シリーズID:	PA00000012
会議名:	International Symposium on Metallography and Materials Science
回次:	16th
会議開催地:	Stará Lesná, Slovak Republic
会議開催年:	2016.04.20-2016.04.22
論文注記:	16th International Symposium on Metallography and Materials Science, 20-22 April 2016, Stara Lesna, Slovak Republic

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