Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on- Glass Packaging Using Anisotropic Conductive Film Bonding

Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on- Glass Packaging Using Anisotropic Conductive Film Bonding

著者名:

掲載資料名:

Nano Engineering and Materials Technologies

シリーズ名:

Materials science forum

シリーズ巻号:

886

発行年:

2017

開始ページ:

97

終了ページ:

101

総ページ数:

5

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035711042 [3035711046]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00066558
シリーズID:	PA00000012
会議名:	International Conference on Nanostructures, Nanomaterials and Nanoengineering (ICNNN 2016) ; International Conference on Materials Technology and Applications (ICMTA2016)
回次:	5th
会議開催地:	Singapore
会議開催年:	2016.10.29-2016.10.31
論文注記:	5th International Conference on Nanostructures, Nanomaterials and Nanoengineering 2016 (ICNNN 2016) and 2016 International Conference on Materials Technology and Applications (ICMTA2016), Singapore, 29-31 October, 2016

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