Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder

Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder

著者名:

掲載資料名:

THERMEC 2016

シリーズ名:

Materials science forum

シリーズ巻号:

879

発行年:

2017

パート:

3

開始ページ:

2377

終了ページ:

2382

総ページ数:

6

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035711295 [3035711291]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00066551
シリーズID:	PA00000012
会議名:	International Conference on Processing and Manufacturing of Advanced Materials (THERMEC' 2016)
回次:	9th
会議開催地:	Graz, Austria
会議開催年:	2016.05.29-2016.06.03
論文注記:	9th International Conference on Processing and Manufacturing of Advanced Materials (THERMEC' 2016), May 29 - June 3, 2016, Graz, Austria

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